Abstract

This paper presents a coupled electrothermal, electromagnetic, and physical model for microwave power field-effect transistors (FETs). The resulting model is used to investigate large gate periphery pseudomorphic high electron-mobility transistor devices. The contribution to the output power of each cell of the transistor is simulated, as well as their contribution to the heating of the device. This approach allows the investigation of the interaction between the thermal behavior, the dc bias, and the microwave circuit operating conditions. This paper reveals for the first time a more complex interaction between the thermal and microwave behavior of large-power FETs

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