Abstract
Defect-less semiconductor-on-insulator (-OI) by a cost-effective and low temperature process is strongly needed for monolithic 3D (M3D) integration. Toward this, in this paper, we present a cost-effective fabrication of the InGaAs-OI structure featuring the direct wafer bonding (DWB) and the epitaxial lift-off (ELO) techniques as well as the re-use of the InP donor wafer. We systematically investigated the effects of the pre-patterning of the III-V layer before DWB, surface reforming (hydrophilic), and electro-chemical etching to speed up the ELO process for a fast and high-throughput process, which is essential for cost reduction. We also demonstrated the re-usability of the InP donor wafer. Finally, as a result of the high film quality of the InGaAs channel combined with DWB and ELO, fabricated InGaAs-OI MOSFETs show a record-high effective mobility of ∼2800 cm2/Vs among surface channel Ino.53Gao.47As MOSFETs reported so far.
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