Abstract
Back-contact modules made using a conductive back-sheet foil have a number of advantages over standard H-pattern modules including a higher power output, compatibility with very thin cells and rapid, high yield manufacturing. In this paper, we present the results of efficiency and material optimisation for cost reduction: decreasing the encapsulant thickness, printing smaller contact pads and reducing the Ag paste consumption in combination with increasing the number of metal wrap through vias. Experimental and modelling data show that the cell and module performance can be improved whilst reducing the module costs.
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