Cost and performance criteria for selection of materials and processes in microelectronics packaging

Abstract

Journal of Electronics ManufacturingVol. 01, No. 01, pp. 13-22 (1991) PapersNo AccessCost and performance criteria for selection of materials and processes in microelectronics packagingWILLIAM EAKIN, KEITH GARDINER, and JAWAHAR NAYAKWILLIAM EAKINCenter for Manufacturing Systems Engineering, Lehigh University, Bethlehem, PA, USAW. Eakin is now with IBM General Technology Division, Essex Junction, Vermont. Search for more papers by this author , KEITH GARDINERCenter for Manufacturing Systems Engineering, Lehigh University, Bethlehem, PA, USA Search for more papers by this author , and JAWAHAR NAYAKCenter for Manufacturing Systems Engineering, Lehigh University, Bethlehem, PA, USA Search for more papers by this author https://doi.org/10.1142/S0960313191000035Cited by:2 PreviousNext AboutSectionsPDF/EPUB ToolsAdd to favoritesDownload CitationsTrack CitationsRecommend to Library ShareShare onFacebookTwitterLinked InRedditEmail AbstractSome of the forces pushing technology today are system speed, reliability, and cost of manufacturing. System speed has become less limited by gate speeds causing signal-line length to be the dominant factor. Shortening the distance between IC dies implies multi-chip modules. Reliability of circuit systems is a function of, among other things, the number of interconnections within the circuit system. Research needs to continue along several directions. This paper discusses a strategy for selecting materials and choosing fabrication processes based on the cost and availability of materials, equipment and facility. The density and performance that can be obtained within each silicon die will continue to improve. However, future advances in silicon technology will require substantial investment. The functionality of presently available silicon dies is adequate for most high-volume consumer applications. Development of the packaging and manufacturing systems for application of these dies can afford great benefits in terms of overall module costs. Research investment in these areas offers a potential for good returns with low risk. There is an urgent need for consideration of manufacturing systems aspects in the design of future electronics packaging.Keywords:Experience curvesfeature scalingyield issuesmultichip modules FiguresReferencesRelatedDetailsCited By 2Composites for Electronic Packaging and Thermal ManagementD.D.L. Chung and Carl Zweben1 Jan 2000Making Circuits More than Once: The Manufacturing Challenges of Electronics Intensive ProductsD J Williams, P P Conway and D C Whalley9 August 2016 | Proceedings of the Institution of Mechanical Engineers, Part B: Journal of Engineering Manufacture, Vol. 207, No. 2 Recommended Vol. 01, No. 01 Metrics History Received 1 May 1991 Accepted 1 June 1991 KeywordsExperience curvesfeature scalingyield issuesmultichip modulesPDF download