Abstract

In this study, Cu-Ni-Si alloy was subjected to corrosion resistance tests under simulated high-temperature, high-pressure H2S and Cl− environments. The corrosion rates, electrochemical performance, surface morphologies, and chemical compositions of the Cu-Ni-Si alloy after corrosion were analyzed by the mass loss method, electrochemical impedance spectroscopy, scanning electron microscopy, energy-dispersive x-ray spectrometry, and x-ray diffraction. The results showed that, at the initial stage of corrosion, because of the loose corrosion product layer initially formed on the surface, a high corrosion rate was observed for the Cu-Ni-Si alloy under high-temperature, high-pressure environments. With the progress of corrosion, the corrosion rate gradually decreased and reached a steady state. Because at the later stage, a passive film was formed on the alloy surface, further inhibiting the corrosion of the alloy and improved its corrosion resistance. The Cu-Ni-Si alloy exhibited good corrosion resistance under high-temperature, high-pressure H2S and Cl− environments.

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.