Abstract
Implantable micro devices employing packaging technologies other than metallic enclosures are yet to be developed. Packaging films deposited by chemical vapor deposition are good candidates for this task due to their low permeability to gases, low chemical reactivity and high conformality. Nine biocompatible materials were studied: Al2O3, BN, DLC, HfO2, SiC, SiN, SiO2, SiOC and TiO2. Ultra-thin films (5─100 nm) were deposited by plasma enhanced chemical vapor deposition (PECVD) or atomic layer deposition (ALD) on substrates commonly found in microelectronic devices: crystalline silicon, copper and tungsten nitride. It was found that deposited films of BN, SiC, SiO2 and SiN do not offer corrosion protection of substrates in hot saline solution. Whereas, films of Al2O3, DLC, SiOC and TiO2 showed very low chemical reactivity in saline baths, and multilayers of TiO2 on top of Al2O3 displayed remarkable corrosion protection of selected substrates.
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