Abstract
Recently, the corrosion resistance of printed wiring board (PWB) finishes has generated considerable interest due to field failures observed in various parts of the world. This study investigates the corrosion issues associated with the different lead-free PWB surface finishes. Corrosion products on various PWB surface finishes generated in mixed flowing gas (MFG) environments were studied, and analysis techniques such as scanning electron microscopy, energy-dispersive x-ray, x-ray diffraction, focused ion beam, and scanning Auger microscopy were used to quantify the corrosion layer thickness and determine the composition of corrosion products. The corrosion on organic solderability preservative samples shows similar corrosion products to bare copper and is mainly due to direct attack of copper traces by corrosive gases. The corrosion on electroless nickel immersion gold occurs primarily through the porosity in the film and is accelerated by the galvanic potential between gold and copper; similar results were observed on immersion silver. Immersion tin shows excellent corrosion resistance due to its inherent corrosion resistance in the MFG environment as well as the opposite galvanic potential between tin and copper compared with gold or silver and copper.
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