CORROSION OF LEAD SHIELDING IN MODEL 9975 PACKAGE

Abstract

Experiments were performed to determine the corrosion rate of lead when exposed to off-gas or degradation products of organic materials used in the model 9975 package.[1] The experiments were completed within the framework of a parametric test matrix with variables of organic configuration, temperature, humidity and the effect of durations of exposure on the corrosion of lead in the 9975 package. The room temperature vulcanizing (RTV) sealant was the most corrosive organic species in the testing, followed by the polyvinyl acetate (PVAc) glue. The Celotex{copyright} material uniquely induced measurable corrosion only in situations with condensed water, and to a much lesser extent than the PVAc glue and RTV. The coupons exhibited faster corrosion at higher temperatures than at room temperatures. There was a particularly pronounced effect of condensed water as the coupons exposed in the cells with condensed water exhibited much higher corrosion rates. In the 9975 package, the PVAc glue was determined to be the most aggressive due to it's proximity in the design. The condition considered most representative of the package conditions is that of the coupon exposed to the Celotex{copyright}/glue organic exposed in the ambient humidity conditions. The corrosion rate of 2 mpy measured in the laboratory experiments for this condition is considered to be a bounding condition to the 9975 package conditions when the laboratory results are extrapolated to actual package conditions, and is recommended as a conservative estimate for package performance calculations.