Abstract
The behaviour of several types of silicon nitride-based materials in contact with molten copper has been evaluated. Tests were performed at a temperature of 1400 K for a holding time of 260 h in fluido-dynamic conditions.
Full Text 
Sign-in/Register to access full text options
Sign-in/Register to access full text options 
Published version (
Free)
Free) 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call
