Corrosion-induced fracture of Cu–Al microelectronics interconnects

Abstract

We present a mechano-chemical model that couples corrosion, mechanical response, and fracture. The model is used to understand the failure of Cu wires on Al pads in microelectronic packages using a multi-phase field approach. Under high humidity environments, the Cu-rich intermetallic compounds (IMC), Cu9Al4, formed at the interface between Cu and Al, undergo a corrosion degradation process. The IMC expands while undergoing corrosion, inducing stresses that nucleate and propagate cracks along the interface between the Cu-rich IMC and Cu. Furthermore, the volumetric expansion of the IMC may cause damage to the passivation layer and enhance the nucleation of new corrosion pits. We show that the presence of a crack accelerates the corrosion process. The model developed here can be extended to other systems and applications.