Abstract
The corrosion behaviors of Sn-20Bi-xCu-yIn (x=0.3, 0.5 wt.%; y=1, 2, 3 wt.%) in 3.5 wt.% NaCl solution at room temperature were investigated. Electrochemical impedance spectroscopy (EIS) plots, potentiodynamic polarization curves, and corroded surface product characterization were used to evaluate the corrosion resistance of the solders. Analysis of EIS and polarization curves shows that the corrosion resistance of the solders decreases as the In and Cu contents increase. Scanning electron microscopy, energy dispersive spectroscopy, X-ray diffraction, and X-ray photoelectron spectroscopy were applied to characterizing the corrosion product. It is found that the corrosion product is Sn3O(OH)2Cl2, which cannot play a protective role because of its loose structure. Sn-20Bi-0.3Cu-1In has the best corrosion resistance.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callMore From: Transactions of Nonferrous Metals Society of China
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
