Abstract
Copper silica composite coatings are an attractive alternative to chromium and nickel coatings in order to avoid environmental problems and for application in electrical devices. However, co-deposition of SiO2 particles with metals occurs to a rather limited extent, generally under 1%, due to the hydrophilicity of SiO2, which makes the incorporation of particles in a metallic matrix difficult. To overcome this drawback, the influence of cetyl trimethyl ammonium bromide (CTAB) on the deposition and corrosion behavior of Cu–SiO2 coatings on steel has been studied. It was established that CTAB plays a beneficial role in SiO2 suspension stabilization, promotes the co-deposition of nanoparticles in the copper matrix and improves the deposit morphology and structure. Consequently, a higher corrosion resistance of Cu–SiO2 deposits obtained in the presence of CTAB was noticed. The most important effect was observed in the case when CTAB was used in concentration of 10−3 M in the electroplating bath.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
