Abstract
X-ray photoelectron spectroscopy (XPS) analysis of four Cu/SiO{sub 2} catalyst systems of different particle sizes of CuO on the surface showed variation in the relative peak area intensities of the shake-up lines to main core levels of the Cu 2p orbitals. These differences were attributed to various degrees of XPS-induced reduction of CuO initially formed on the surface by spin coating copper(II) acetate {l_brace}Cu-(CH{sub 3}CO{sub 2}){sub 2}{center_dot}H{sub 2}O, Cu(ac){sub 2}{r_brace} solutions of varying concentration. Changes in CuL{sub 3}M{sub 4,5}M{sub 4,5}X-ray excited Auger (XAES) line shapes under time-dependent exposure to the soft Mg K{alpha} X-rays revealed that smaller particle sizes were more susceptible to reduction to Cu(+1) than larger ones. The degree of reduction of Cu(+2) to Cu(+1) correlated with measured atomic force microscopic (AFM) particle heights of CuO on these substrates prior to XPS.
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