Abstract
The effects of the surface modification of poly(ether ether ketone) (PEEK) by plasma treatment have been characterized by X-ray Photoelectron Spectroscopy and wettability measurement, while the adhesion of metallic thin films grown by PVD has been assessed by the pull-off test. To investigate the role of the modified surface chemistry on the practical adhesion stress of aluminium thin films, two different plasma technologies were considered: (i) atmospheric pressure plasma and (ii) low pressure microwave plasma. Though on different scales, both of these plasmas under oxidative conditions induced a significant increase of the surface concentration of CO (ketones) and COO (esters and acidic) functional groups, while COC (ether) groups remained constant. It is shown that after plasma functionalization, when the surface concentration of CO and COO are above a critical value, a strong correlation appears between the concentration of these polar groups, the wettability and the adhesion potential.
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