Correlation between the Interface Width and the Adhesion Strength of Copper Films Deposited on Ion-Etched Carbon Steel Substrates by Varying the Bias Voltage

Abstract

The present study has been conducted in order to determine the influence of negative bias voltage applied to substrate on adhesion of copper films deposited on carbon steel substrates. The adhesion strength has been evaluated by the scratch test. Coatings were deposited by a DC magnetron sputtering system. The substrates were firstly mechanically polished and then ion-etched by argon ions prior to deposition. Adhesion was found to increase with the bias voltage. The critical load had a value of 9.5 g for an unbiased substrate and reached 18.5 g for a bias voltage of 600 V. Equally important, the interface width, measured using Auger electron spectroscopy, increased as a function of the bias voltage. The width of the interface is related to the time of ion milling in the Auger spectrometer. The size of this width is obtained from the Auger elemental depth profiles through measuring the depth of the interface coating/substrate. The width had a value of 335 min with a bias of 600 V whereas it didn't exceed 180 min when the substrate was unbiased. Therefore, the effect of the bias voltage was to expand the interface because of the diffusion phenomenon and physical mixing of materials at the interface. Moreover, the critical load increased with the increase of the interface width.