Abstract
TiO 2, TiO 2− x and Ti 3O 5 thick-film structures on corundum Al 2O 3 substrates were prepared using screen-printing technology. The screen-printed deposits were sintered up to 1500 °C in oxidising and reducing atmospheres to vary the Ti 4+/Ti 3+ ratio and consequently water contact angle. The structure of the thick films was studied with an X-ray powder diffractometer (XRD). The microstructural characteristics and the chemical composition were checked with a scanning electron microscope, equipped with an energy-dispersive spectrometer (EDS). The Ti–O films, up to 55 μm thick, exhibited excellent adhesion to the substrate and had uniform grain- and pore-size distributions. Ti 3O 5 and Al 2O 3 were found to be compatible phases up to 1500 °C in a reducing atmosphere. However, rutile-type TiO 2 and Al 2O 3 are not compatible compounds at temperatures up to 1400 °C, in either oxidising or reducing atmospheres. TiO 2 and TiO 2− x form two types of reaction products with Al 2O 3. These reaction products were found to have various Ti/Al ratios.
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