Abstract
Separation by implanted oxygen (SIMOX) wafers and bonded wafers are commercially available silicon-on-insulator (SOI) wafers. In particular, SIMOX process technologies have become important in system-on-a-chip (SoC) fabricated on SOI/Bulk hybrid substrates composed of SOI region for the logic circuits and Bulk region for the dynamic random access memories (DRAMs) in recent years [1].
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