Abstract
The state of cure of a thermosetting resin is the main characteristic of the cure reaction. It is easy to determine at any place in a sample and at any time during the cure process and especially at the end of this process for the final material. From a practical point of view, the mechanical properties of the final material are of most interest. Correlations are made between the mechanical properties of bulk moulding compounds determined under dynamic conditions and the values of the state of cure. Results are obtained for the in-plase modulus and the loss factor not only at room temperature but also at temperatures as high as 120°C. The state of cure is determined by using a numerical model taking into account heat conduction and heat evolved by the overall cure reaction. An increase in the state of cure (SOC) is observed for the samples with a rather low initial SOC value during the heating period up to 120°C when the mechanical properties are measured in the scanning mode.
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