Abstract
A formaldehyde-free adhesive consisting of a corn flour/NaOH adhesive mixture and a mimosa tannin/hexamine intermediate component was developed and evaluated for application to wood panels such as particleboards. The main ingredients of this adhesive include corn flour, NaOH, mimosa tannin and hexamine. This study investigated the physical properties (rheological and thermal analysis) of corn flour/NaOH and mimosa tannin/hexamine adhesives as well as mechanical properties of particleboards produced with these adhesives. Thermomechanical (TMA) experiments indicate the best performance of the adhesives to be around the relative mass proportions of 50:50 between corn flour/NaOH and mimosa tannin/hexamine. Former NMR measurements on corn starch and mimosa tannin proved that the two components behave as a polymer blend rather than co-reacting. The laboratory results show that particleboards bonded with the adhesive at this optimal ratio show good mechanical properties. Moreover, the formaldehyde emission levels obtained from boards bonded with the optimal adhesive were considerably lower to those obtained from boards made with control urea formaldehyde.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
