Coreless substrates status

Abstract

Coreless organic substrates have been desired for many years in order to provide the ultimate wiring capacity that can be achieved anywhere. To date, there have been few successful implementations only for small body sizes because of the choice of dielectric materials. Here, a technology has been developed based on prepreg dielectrics and pattern plating to build sequentially the layers of a coreless substrate. A temporary carrier is employed to facilitate handling during the manufacturing process.