Abstract
AbstractIn this study the removal of Cu(II) ions from aqueous solution was performed at different concentrations, temperatures, and pHs using ethanol‐based organosolv lignin as the adsorbent. The results indicated that the amount of Cu(II) ions adsorbed onto the lignin increased with increasing concentration and pH; however, it decreased with an increase in temperature. It was possible to remove 40.74% (maximum removal) of Cu(II) ions from aqueous solution by using organosolv lignin within 10 min under certain conditions (3 × 10−4 M and 20°C). The adsorption process was determined to be consistent with the Freundlich isotherm. Furthermore, it was found that 40% (maximum recovery) of the Cu(II) ions adsorbed on the organosolv lignin could be recovered using HCl with an initial concentration of 3 × 10−4 M and a contact time of 10 min. © 2003 Wiley Periodicals, Inc. J Appl Polym Sci 89: 1537–1541, 2003
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