Abstract
1. A study was made of the effects of process parameters in the deposition of copper on SmCo5 powder particles by the contact method upon the yield of copper into the coating. 2. It was established that the copper content of the powder is strongly affected by the pH of the working cupric chloride solution and its concentration; the temperature and prior pickling of SmCo5 powder have no significant effect upon the degree of copper plating of the powder. 3. A study was made of the specific surface of metal-plated SmCo5 powder as a function of its copper content. It was established that the optimum copper content is 4–10%, enabling even and continuous copper deposits to be obtained on the surfaces of powder particles.
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