Abstract
Copper lead frame was chosen as an on-board reliability enhancement for the BLP (bottom leaded plastic) package. Adopting the copper lead frame needed a verification process for the package reliability because of its high affinity with oxygen that degrades package reliability. A series of tests were performed to select the best copper material and to determine the adhesion index parameter. The experimental results showed that the adhesion strength between the copper lead frame and EMC (epoxy molding compound) was affected by alloy composition, oxide layer thickness, and cupric/cuprous oxide ratio, Among them, the adhesion index parameter proved to be the cupric/cuprous oxide ratio. When it falls between 0.2-0.3, the highest adhesion strength was obtained regardless of alloy composition and oxide thickness. From the adhesion test results, the Cr-Zr-Cu copper alloy was employed as the lead frame for the 54-pin BLP package. The package reliability and on-board reliability tests including surface mountability, mechanical robustness, and solder joint reliability were carried out to compare the 54-pin BLP package, with Cr-Zr copper alloy and alloy 42 lead frame.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callMore From: IEEE Transactions on Electronics Packaging Manufacturing
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
