Copper in compensated p- and n-type Czochralski silicon: Diffusivity, influence on the majority charge carrier density and mobility

Abstract

Copper contamination risks are present throughout the whole crystalline silicon solar cell process flow, namely during ingot growth processes using recycled feedstock, wafer sawing and metallisation. Copper is a fast-diffusing impurity which can modify the carrier transport and recombination properties. The aim of this study is to present new insights into the properties of copper-contaminated highly doped and compensated silicon, with a focus on the copper diffusivity and the influence of this impurity on the majority carrier mobility and density. For this, compensated Czochralski silicon ingots were grown from electronic grade feedstock doped with boron and phosphorus, and the wafers intentionally contaminated with copper. Its concentrations were measured by Glow Discharge Mass Spectrometry, while the electrical properties were extracted from Hall Effect measurements. The dopant concentrations were used to compute the effective diffusivity of interstitial copper and important changes in the copper diffusivity are expected in the vicinity of the p-type/n-type transition. For the n-type compensated wafers, a strong migration of copper atoms towards the surface and a reduced copper bulk content were highlighted. Furthermore, the presence of precipitates was experimentally revealed. Both the equilibrium electron density and electron mobility were not influenced by the contamination. In p-type compensated material, copper atoms did not accumulate at the surface, probably due to both the limited copper precipitation in p-type silicon and the lower copper diffusivity. In addition, the equilibrium hole density was not influenced. However, the hole carrier mobility was affected, likely associated to the higher bulk copper content. • Highly doped compensated silicon was intentionally contaminated with copper. • Electrical properties were obtained from Hall Effect measurements. • Large differences in copper diffusivity close to the p-to n-type transition. • Strong migration of copper towards the surface in n-type compensated wafers. • Equilibrium electron density and mobility are not influenced by the contamination.