Abstract
Printed circuit boards (PCBs) have a wide range of applications in electronics where they are used for electric signal transfer. For a multilayer build-up, thin copper foils are alternated with epoxy-based prepregs and laminated to each other. Adhesion between copper and epoxy composites is achieved by technologies based on mechanical interlocking or chemical bonding, however for future development, the understanding of failure mechanisms between these materials is of high importance. In literature, various interfacial failures are reported which lead to adhesion loss between copper and epoxy resins. This review aims to give an overview on common coupling technologies and possible failure mechanisms. The information reviewed can in turn lead to the development of new strategies, enhancing the adhesion strength of copper/epoxy joints and, therefore, establishing a basis for future PCB manufacturing.
Highlights
IntroductionNowadays, most electronics, electronics, ranging ranging from from cell cell phones, phones, Nowadays, printed printed circuit circuit boards boards (PCBs)(PCBs) are are used used in in most consumer to high-end high-end products products such such as as sophisticated sophisticated computer computer systems. systems.consumer electronics, electronics, automotive, automotive, etc. etc. toThe demand for PCBs has increased constantly, leading to an entrenchment of PCBs from theThe demand for PCBs has increased constantly, leading to an entrenchment of PCBs from the 1970s1970s in most branches of electronics.Since the electronic industry has experienced rapid in most branches of electronics
The invention of multi-layer boards triggered the miniaturization of electronic products and continued to drive PCB manufacturing technology towards smaller and more densely packed boards with increased electronic capabilities
The copper/epoxy joints are formed by laminating a pretreated copper with epoxy resin composites, and these are the major insulating materials that are used in PCB manufacturing under heat and pressure
Summary
Most electronics, electronics, ranging ranging from from cell cell phones, phones, Nowadays, printed printed circuit circuit boards boards (PCBs). The electronic industry has experienced rapid in most branches of electronics. The invention of multi-layer boards triggered the miniaturization of electronic products and continued to drive PCB manufacturing technology towards smaller and more densely packed boards with increased electronic capabilities. Thereby, manufacturing is dependent on the adhesion between copper and epoxy composites. Due to increasing component density in PCBs and decreasing line width of copper wires and interconnects, the temperature within an electronic device can reach up to 200 ◦ C during operation [2]. Weak copper/epoxy joints cause failures during the application of multi-layer boards. Crack growth at the interface of the copper/epoxy joint and subsequent delamination are the consequences. The copper/epoxy joints are formed by laminating a pretreated copper with epoxy resin composites, and these are the major insulating materials that are used in PCB manufacturing under heat and pressure
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