Abstract
Copper bottom-up deposition in 200 nm trenches by an acid-copper sulfate with only two additives [poly(ethylene glycol) (PEG) and Cl ] is achieved. The inhibiting effect of electrodeposition by PEG is strongly related to Cl - concentration. Secondary-ion mass spectroscopy measurements show that Cl - is consumed in the electroplating process. The explanation of bottom-up deposition realized in copper superfilling, in which the decrease of Cl - concentration causes rapid electrodeposition on trench bottoms, is verified experimentally.
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