Abstract
Bacterial biofilms on titanium implant surfaces may lead to the development of peri-implant diseases. For the first time, Ti6Al4V/Cu prepared by double-wire electron beam additive manufacturing (EBAM) were subjected to in-vitro antimicrobial test. The antimicrobial activity of the materials was investigated against S.aureus and C.albicans strains depending upon the amount of copper added. Increasing the copper content in material to 9.7 wt% allowed achieving 99% bacterial population reduction on the copper-containing substrate. Such an enhanced antimicrobial acivity of the substrate was caused by the release of copper ions from the Ti6Al4/Cu alloys.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
