Copper and nickel tolerance in Typha latifolia clones from contaminated and uncontaminated environments

Abstract

Plants of Typha latifolia L. derived from overwintering rootstocks collected from a site contaminated with copper and nickel and an uncontaminated control location were maintained in the laboratory for a minimum of three vegetative generations. Uptake of copper and nickel by both clones from contaminated nutrient solutions was greater than from control solutions. Growth of both clones was inhibited by 100 μg g−1 Cu–EDTA, and 600 μg g−1 Ni–EDTA. Evidence suggesting that copper and nickel tolerance has evolved in the population from the contaminated site could not be detected. Indeed clones from the uncontaminated site showed greater growth under copper stress than clones from the contaminated site, while growth of both clones was equally depressed under conditions of nickel stress.