Coplanarity inspection of BGA solder balls based on laser interference structure light

Abstract

Using laser interference structure light for profilometry is a rapid, non-contact, full-field profile and high accuracy measuring method.And it has been a promising technique in complicated geometrical shape measurement. In this paper, a fast and cost-effective measurement method of coplanarity inspection of ball grid array (BGA) solder balls is proposed. Laser interference structure light can be obtained by using the principle of shearing interferometry. The collimated and beam expanded laser produced interference fringe by the high reflection rate optical flat. After laser interference fringe project on the surface of object and the structured light would modulated. The light signal pass through the image optical grabber and captured by the CCD image sensor. The height of each point on object can be demodulated by the imaging processing software.This method to construct the measurement appliance for coplanarity inspection of ball grid array (BGA) chip solder ball. Experiments have shown that the coplanarity measurement of BGA solder balls is very efficient and effective with the measurement. The measurement accuracy achieve micrometer level. The processing time of the measurement accuracy is less than 3s on a personal computer. This measurement appliance could completely meet the demand of measure.