Converting non-metallic printed circuit boards waste into a value added product.

Shantha Kumari Muniyandi,Siti Suhaila Mohamad,Azman Hassan,Johan Sohaili

doi:10.1186/2052-336x-11-2

Abstract

The aim of this study was to investigate the feasibility of using nonmetallic printed circuit board (PCB) waste as filler in recycled HDPE (rHDPE) in production of rHDPE/PCB composites. Maleic anhydride modified linear low-density polyethylene (MAPE) was used as compatibilizer. In particular, the effects of nonmetallic PCB and MAPE on mechanical properties of the composites were assessed through tensile, flexural and impact testing. Scanning electron microscope (SEM) was used to study the dispersion of nonmetallic PCB and MAPE in the matrix. Nonmetallic PCB was blended with rHDPE from 0–30 wt% and prepared by counter-rotating twin screw extruder followed by molding into test samples via hot press for analysis. A good balance between stiffness, strength and toughness was achieved for the system containing 30 wt% PCB. Thus, this system was chosen in order to investigate the effect of the compatibilizer on the mechanical properties of the composites. The results indicate that MAPE as a compatiblizer can effectively promote the interfacial adhesion between nonmetallic PCB and rHDPE. The addition of 6 phr MAPE increased the flexural strength, tensile strength and impact strength by 71%, 98% and 44% respectively compared to the uncompatibilized composites.

Highlights

In recent years throughout the world including Malaysia, there has been increasing concern about the growing volume of end of life electronics and the fact that much of it is consigned to landfill without any attempt being made to recycle the nonmetallic materials it contains
The system containing 30 wt% printed circuit board (PCB) was chosen in order to investigate the effect of modified linear low-density polyethylene (MAPE) compatibilizer on the mechanical properties of the composites
The addition of 6 phr MAPE increased the flexural strength and flexural modulus of composites by 71% and 69% respectively when compared to uncompatibilized composites

Summary

Introduction

In recent years throughout the world including Malaysia, there has been increasing concern about the growing volume of end of life electronics and the fact that much of it is consigned to landfill without any attempt being made to recycle the nonmetallic materials it contains. A large amount of nonmetallic materials in PCBs are disposed of by combustion and disposal in landfill as the main method for treating nonmetals in PCBs, but it may cause secondary pollution and resource wasting. The problem is generally focused on the non metallic materials since it is being noted by Department of Environment (DOE) Malaysia as hazardous and being listed under SW 501/ SW 110 of the Environmental Quality (Scheduled Waste) Regulations 2005. Since it contains chemical hazards [1], it needs to be disposed at licensed scheduled waste disposal site which is Kualiti Alam Sdn. Bhd.

Objectives

Results

Conclusion