Abstract
Soft-errors caused by lead in solder-bumping have been a concern for many years. The problem is of special concern for high-density interconnection applications requiring solder to be placed directly over active circuitry. In that situation, alpha particles emitted by radioactive lead cause soft-errors with no possibility of shielding circuitry. For optimal cost-effectiveness, though, not all solder bumped wafers require low-alpha lead. MCNC has developed a solder bumping facility with both a research branch at MCNC and a full-scale production facility at its spin-off, Unitive Electronics Inc. We present results here of our work in incorporating low-alpha lead as part of our solder bumping process. We describe the amount of cross-contamination measured when alternating plating baths of regular lead and low-alpha lead.
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