Abstract
In this study, intermetallic compound formation at the interface between aluminum and copper during hydrostatic extrusion was simulated by performing a solid state diffusion bonding experiment with various processing parameters, including bonding temperature and pressure and holding time, and by inserting an Ag colloid layer between the aluminum and copper. Regression equations were developed to predict thickness of diffusion layer and interface hardness.An intermetallic compound formed at the interface between the Al and Cu during diffusion bonding at 420°C and 240MPa for 60min, and it was effectively controlled by inserting an Ag colloid. These experimental data will be useful for setting up processing parameters to prepare Al/Cu matrix composite materials by using hydrostatic extrusion.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
