Abstract
From previous studies suggesting that controlled crystal growth and crystal dissolution are governed by the same laws, we have previously finalized the chemical lapping or controlled dissolution of AT quartz plates in NaOH,H 2 O. The quality of chemical polishing changes with the crystallographic orientation of plates. Consequently, we have investigated similar basic solvents other than NaOH medium to obtain a good chemical polishing of SC cuts. Surface roughness evolution was checked and shows that controlled dissolution of SC cuts has to take place in KOH medium. As shown in NaOH medium, initial surface state has a great influence on thinning down. Dissolution rates measured against temperature in different media and activation energies are compared
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