Abstract
Driven by continually shrinking feature sizes and adoption of ever more fragile materials in IC manufacturing, it has become crucial to develop effective and low impact processes that are benign to features on wafers. Recently, there is increasing interest in using gasified DI water in photolithography, wet etch & clean, mask clean and CMP applications. In this paper, we describe the design and development of an automated in-line CO2 gasification system using Entegris all PFA hollow fiber membrane-based contactors. The paper addresses key system design features to enable a responsive and seamless process with minimum system downtime. Capacity and control data demonstrating the versatility and robustness of the system will also be presented.
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