Abstract
The presented work reports the fabrication of 4×32 arrays of fully addressable proximity probes, which are initially and controllably off-plane deflected (bent). Such a deflection is required for the simultaneous approach and scanning of all cantilevers. It is realized by deposition of the silicon cantilevers with Si3N4 film inducing tensile stress. ANSYS simulations are used to calculate the off-plane deflection for different thickness of the cantilever and the Si3N4 layer and compared with experimentally obtained values. Cantilever arrays with set bending up to 50 μm, employing LPCVD silicon nitride film with a tensile stress of 750 MPa are fabricated.
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