Control of thermal regime of thermoelectric coolers inuniform temperature field

Abstract

The possibility of using a complex of thermoelectric coolers to control the thermal regime of heat-loaded elements of radio electronic equipment, the parameters of which significantly depend on the temperature conditions of operation, is considered.The analysis was carried out for conditions of the same level of cooling of semiconductor elements for typical temperature drops, rangeof dissipation power, current modes of operation, and geometry of thermoelement legs.It is shown that it is rational to use distributed active cooling systems to ensure the required thermal regime of spatially distributed heat-loaded elements with different dissipation power. To ensure the required thermal conditions, it is proposed to use both individual and group variants of the structure layout: heat-loaded element-thermoelectric cooler-radiator.The developed mathematical models of the relationship between the number of thermoelements and the thermal load, the power consumption with the temperature difference and the operating current are analyzed. Models of the main operational characteristics of coolers that are significant for control systems are presented: the relative failure rate and the time to reach a stationary mode.The results of calculations of the main parameters, reliability indicators and dynamic characteristics for an individual version of the layout of thermoelectric coolers with different dissipation power and current operating modes are presented. The group diagram of the arrangement of the object-cooler with series connection and located on the same heat sink and their comparative analysis is considered. When choosing the current mode, it is necessary to take into account the mutual influence and weight of each of the limiting factors, by varying which, when designing the complex and thermoelectric coolers, it is possible to choose compromise modes of operation.