Abstract
In this paper we study the corrosion phenomena in copper surface thin layers with the EIS technique. The experimental results show that the electrochemical corrosion in nanocrystalline layers produced by an electrocrystallization method increases significantly when compared with that of microcrystalline materials. It is shown that decreasing the grains dimension of the nanocrystalline layers results in an increase of both the corrosion rate and the double layer capacitance. The presented approach has the advantages of automation of the modeling process, great diversity of model structures, high stability and efficiency of parameter optimization.
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