Abstract
New continuous bending-drawing process to manufacture ultrafine electric wire is proposed. This process is capable of manufacturing ultrafine wire with excellent electrical and mechanical properties, by controlling the microstructure and grain orientations affected by the loading directions during drawing and bending. The mechanical properties and microstructure evolution of copper alloy deformed by the process was systematically investigated. It was confirmed that change of grain size and deformation induced texture that was introduced by the process have great effects on the successful manufacturing of ultrafine wire of 210 μm diameter with excellent mechanical properties, such as good ultimate strength and total elongation.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
