Abstract

The electrical characteristics of titanium nitride (TiN x ) contacts to n- and p-type GaN films, deposited by reactive magnetron sputtering at room temperature, are investigated. The contacts of TiN x to n-type GaN are ohmic and to p-type GaN are rectifying, while their properties are strongly dependent on the stoichiometry of the deposited titanium nitride layer. It is shown that the ohmic behavior of the contacts is associated with the presence of a high density of interface states and not to the low Schottky barrier.

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