Abstract
A novel method for the laser to fiber coupling is presented in which coarse alignment is achieved through micromachined v-grooves and mirrors in a fused silica substrate. Furthermore, fine repositioning is done in a noncontact manner by using a femtosecond laser to induce localized nanoscopic volume changes in specific locations within the bulk of the substrate, which, once combined with monolithic flexures within the substrate, produces a highly controlled motion. Using this principle, we overcome inherent manufacturing/assembly tolerances to achieve near theoretical coupling efficiency in a permanent manner. This proof of concept demonstrates a novel packaging principle where a sub-nm positioning resolution is achieved over tens of micrometers range of motion, efficiently overcoming intrinsic manufacturing tolerances.
Highlights
I N THE past decades, there has been a considerable research effort in the area of integrated photonic circuits
One of the main challenges toward industrialization is the efficient coupling between single-mode fibers (SMFs) and nanometerscale photonic waveguides on a photonic integrated circuits (PICs) primarily due to their large mode mismatch
The complete device is fabricated in a single step using femtosecond laser machining combined with wet chemical etching
Summary
I N THE past decades, there has been a considerable research effort in the area of integrated photonic circuits. Integrating multiple functionalities on a single chip requires electrical, optical, mechanical, and thermal connections between a PIC and the outside world. One of the main challenges toward industrialization is the efficient coupling between single-mode fibers (SMFs) and nanometerscale photonic waveguides on a PIC primarily due to their large mode mismatch. To solve this problem, a variety of strategies-edge coupling [7], vertical coupling [8], and evanescent coupling [9] have been developed it remains a formidable challenge [6], [10], [11]. Direct-write twophoton laser lithography [15], [16] overcomes many of these
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