Abstract
A land grid array (LGA) socket provides high-density, electrically-separable interconnect between a component and a printed circuit board. The LGA socket must not be susceptible to creep and stress relaxation, which can lead to loss of contact force and consequently the degradation of contact resistance. In this paper, the time-dependent contact resistance failure mechanisms were experimentally assessed and theoretically analyzed for silicone elastomer matrix socket interconnects. A time-dependent physics-of-failure model was developed for contact resistance simulation
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