Abstract

We have observed the formation of heteroepitaxial interfacial layers between silver nanoparticles and a single crystal copper surface by a phenomenon we term “contact epitaxy.” Upon depositing Ag nanoparticles (5–20 nm diameter) onto clean (001) Cu in an ultrahigh vacuum in situ transmission electron microscope, a thin (111)-oriented layer of Ag was detected at the interface between the substrate and particles. Molecular dynamics simulations reveal that the epitaxial layers form within picoseconds of impact, with rapid alignment arising from mechanical relaxation of the highly stressed interface formed upon initial contact. The simulations also show that multiple grains form in the nanoparticle as a consequence of this relaxation process. The unique structure of the nanoparticles, induced by contact epitaxy, is expected to significantly influence physical properties such as interfacial bonding, diffusion, chemical activity, and electrical transport, as well as forming a nucleus for grain growth and epitaxy which we also observe. Due to its simple origin, the phenomenon should also apply to materials systems beyond the field of nanoparticles with implications for cluster deposition, adhesion, rheology, and catalysis.

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