Contact Behavior and Chemical Mechanical Polishing (CMP) Performance of Hole-Type Polishing Pad

Abstract

A polishing pad plays an essential role in determining the chemical mechanical planarization (CMP) performance such as removal rate, planarization, and defectivity. Further, it is important for the polishing pad to maintain good CMP performance throughout its lifespan. In order to achieve high performance and durability, a hole-type pad was suggested as an alternative to the conventionally used pore-type pad. In this study, the effect of the hole density on the CMP performance was examined for a hole-type pad. Surface characterization of the hole-type pad showed that the hole density corresponded to the contact ratio between the pad and the wafer, and therefore, the contact characteristics could be controlled by a hole fabrication process. The experimental results showed that the number of holes play a key role in determining CMP performances. The removal rate decreased with an increase in the hole density. The level of dishing showed an increase with the hole density. The number of CMP scratches decreased at higher hole densities. Higher contact ratio and the presence of large particle trap sites explain the lower trend of the micro-scratch observed. An important advantage of the hole-type pad is that it retains the surface structure as CMP continues, which implies contact behavior is maintained.