Abstract
Bulk metallic glasses (BMGs), which are non-crystalline metallic alloys, can be fabricated with low cooling rates in many alloy systems. So, it is possible to produce BMGs that are several centimeters thick. BMGs exhibit useful engineering properties of high mechanical strength and high corrosion resistance. In order to extend the engineering application of BMGs, it is necessary to establish appropriate joint process of BMG / BMG and BMG / crystalline metal. In this study, surface treatment using hydrofluoric (HF) solution and copper electroplating were performed and the spread test of the Sn-3.0Ag-0.5Cu solder was performed to clarify wetting behavior of the solder on electroplated Cu60Zr30Ti10 BMG.
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