Constructing high-power LED lamp model to evaluate different heat dissipation mechanism design

Abstract

High-power LED lamp is developing in the recent year for energy saving. However, the issue of heat dissipation on LED chip still needs to solve. The heat generation is increased with the power of LED, which reduce the life cycle of LED. LED lamp configuration design influences on dissipating heat from chip since LED array is enclosed by plastic, and surrounds with stationary air. The LED lamp manufactures will to improve the heat dissipation. The study of LED array was focus on heat transfer mechanism. For the fluid flied and heat dissipation analysis for an integrated LED lamp is little. The study is to model a LED lamp to explore thermal and fluid field around the lamp by using FLUENT software. For 6W LED lamp, the simulation results show that 87.8°C of chip temperature and 77.8 mm/s of maximum air velocity inside lampshade were observed and two sets of air circulation were formed. By using the presented model, the different lamp fin designs for heat dissipation of LED chip were evaluated. A LED lamp with 24 fins for higher heat dissipation rate was obtained. The method successfully evaluates the different design. The proposed model is contributed to heat dissipation mechanism design for LED lamp producer.