Abstract
A heat conduction model with an arrow-shaped high thermal conductivity channel (ASHTCC) in a square heat generation body (SHGB) is established in this paper. By taking the minimum maximum temperature difference (MMTD) as the optimization goal, constructal designs of the ASHTCC are conducted based on single, two, and three degrees of freedom optimizations under the condition of fixed ASHTCC material. The outcomes illustrate that the heat conduction performance (HCP) of the SHGB is better when the structure of the ASHTCC tends to be flat. Increasing the thermal conductivity ratio and area fraction of the ASHTCC material can improve the HCP of the SHGB. In the discussed numerical examples, the MMTD obtained by three degrees of freedom optimization are reduced by 8.42% and 4.40%, respectively, compared with those obtained by single and two degrees of freedom optimizations. Therefore, three degrees of freedom optimization can further improve the HCP of the SHGB. Compared the HCPs of the SHGBs with ASHTCC and the T-shaped one, the MMTD of the former is reduced by 13.0%. Thus, the structure of the ASHTCC is proven to be superior to that of the T-shaped one. The optimization results gained in this paper have reference values for the optimal structure designs for the heat dissipations of various electronic devices.
Highlights
Nowadays, electronic information technology is developing rapidly
In the constructal designs of the square bodies, Lorenzini et al [38] set up a heat conduction model (HCM) with X-shaped high thermal conductivity channel (HTCC) in a square heat generation body (SHGB), optimized the structure of Entropy 2020, 22, 475; doi:10.3390/e22040475
Feng et al [43] set up an HCM with “+” shaped HTCC in an SHGB, and reduced the dimensionless maximum temperature differences (DMTDs) of the SHGB by 12.11% after the use of optimized HTCC with variable cross-section
Summary
Electronic information technology is developing rapidly. Many new electronic components are widely used in various aspects, such as national defense, industry, science and technology, and social life. In the constructal designs of the square bodies, Lorenzini et al [38] set up a heat conduction model (HCM) with X-shaped HTCC in a square heat generation body (SHGB), optimized the structure of Entropy 2020, 22, 475; doi:10.3390/e22040475 www.mdpi.com/journal/entropy. Lorenzini et al [38] further established a non-uniform HCM, and showed that the heat conduction performance (HCP) of the new HTCC was about 10% higher than that of the HTCC with uniform one. Hajmohammadi et al [47] built an HCM with multistage irregular dendritic HTCC in an SHGB, and found that the HCP was improved by up to 61% compared with the discussed optimal results in the literatures. The gained optimization results have reference values for the optimal structure designs for the heat dissipations of various electronic devices
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