Abstract

In this study, an (8.2AlN + 4TiC)/Al–0.3Fe–0.1Mn composite was successfully fabricated for elevated– temperature applications by the liquid–solid reaction method, and the high–temperature performance (hot workability) of the composite was evaluated by unidirectional hot deformation experimentation. The tested temperatures and strain rates were 350–500 °C and 0.001–1 s−1, respectively. The results indicated that the peak stress of the composite was as high as 226 MPa at 350 °C and 1.0 s−1, which was significantly higher than the reported strength values of commercial deformed aluminum alloys or other particle–reinforced Al matrix composites under the same experimental conditions. Although the flow stress of the composite decreased with the increase of deformation temperature and the decrease of strain rate, the peak stress remained at 82 MPa under the experimental conditions of 500 °C and 0.001 s−1. This reflected the excellent high–temperature synergistic strengthening effect of the in–situ nanosized AlN and submicron TiC particles. Based on the true stress–true strain curve, the hot deformation constitutive equation of the composite was established and fitted. The relative microstructural evolution of the composite during hot deformation was characterized by electron backscattering diffraction (EBSD) and transmission electron microscopy (TEM). It was found that the Orowan strengthening and load–transfer strengthening effect of the nanosized AlN and submicron TiC particles were the main reasons for their high–temperature strengthening, and the softening effect of the composite could be attributed to dynamic recovery (DRV) and continuous dynamic recrystallization (CDRX), accompanied by partial discontinuous dynamic recrystallization (DDRX). This study provided a new strategy for the design of heat–resistant Al alloys and their high–temperature strengthening and softening mechanism. This study may provide new insights for designing and achieving good workability in Al–based composites for elevated temperature applications.

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