Consideration of Improved Adhesion of Direct Copper Seed Layer by Medium-Vacuum Sputtering Using Vacuum Ultraviolet Light

Abstract

A sputtering method is used to form the seed layer for copper electric plating. In general, copper spatter has weak adhesion to resin, so titanium spatter is combined to increase the adhesion strength. However, etching in the lithography process requires two types of processes, titanium and copper metal. We have reported the improvement of adhesion of copper sputter to glass epoxy resin by medium vacuum sputtering equipment in 242nd ECS meeting. Adhesion strength was improved by performing vacuum ultraviolet treatment as a pretreatment for medium-vacuum sputtering. We discovered the relationship between the hydroxyl groups on the resin surface and the adhesion force by the chemical modification XPS method. Furthermore, by XPS analysis of the peeled copper interface, the adhesion mechanism between the resin and copper due to UV irradiation was estimated. We evaluated the absorption properties in the vacuum ultraviolet region of a thinly processed glass epoxy resin. We investigated the behavior of functional groups at the interface and considered the effect of vacuum ultraviolet rays in the depth direction.