Conoscopic Holography feasibility for form error in-situ monitoring in Additive Manufacturing

Abstract

The lack of standardization and the low quality of parts produced by Additive Manufacturing requires in certain cases the use of in-situ monitoring techniques based on the use of different types of sensors, each of which has advantages and disadvantages depending on the type and nature of the signatures to be analyzed. Therefore, in this work the feasibility of Conoscopic Holography (CH) technology is analyzed for in-situ monitoring of form errors that take place during the creation of each layer in an AM process. The results obtained using this sensor are compared to those of a Coordinate Measuring Machine used as ground truth. The CH sensor is also compared to a Contact Image Sensor in terms of metrological performance, proving the former to be more suitable and versatile for monitoring this type of errors.