Year-end Sale % OFF 
Abstract
Polishing process is one of the most critical manufacturing processes during a metal part production because it determines the final quality of the product. Free-form surface polishing is a handmade process with lots of rejected parts, scrap generation and time and energy consumption. Two different research lines are being developed: prediction models of the final surface quality parameters and an analysis of the amount of material removed depending on the polishing parameters to predict the tool footprint during the polishing task. This research lays the foundations for a future automatic conformal polishing system. It is based on rotational and translational tool with dry abrasive in the front mounted at the end of a robot. A tool to part concept is used, useful for large or heavy workpieces. Results are applied on different curved parts typically used in tooling industry, aeronautics or automotive. A mathematical model has been developed to predict the amount of material removed in function of polishing parameters. Model has been fitted for different abrasives and raw materials. Results have shown deviations under 20% that implies a reliable and controllable process. Smaller amount of material can be removed in controlled areas of a three-dimensional workpiece.
Highlights
Finishing processes as polishing are present in most of the manufacturing workflows for industrial parts
Polishing is still a handmade process that requires research and development to increase the quality and reliability, reduce the parts rejection or time–cost and reach the challenges described in the strategic research agendas of the factories of the future
The chemical mechanical polishing (CMP) is based on a rotating table, a polishing head and a suspension pad, where the surface of the wafer moves across the pad, under pressure, in the presence of slurry abrasive
Summary
Finishing processes as polishing are present in most of the manufacturing workflows for industrial parts. Polishing is still a handmade process that requires research and development to increase the quality and reliability, reduce the parts rejection or time–cost and reach the challenges described in the strategic research agendas of the factories of the future. The chemical mechanical polishing (CMP) was developed during the last 20 years and has rapidly grown as a core technology in the manufacturing of semiconductor devices due to its excellent flattening capacity.[1,2,3,4] The CMP is based on a rotating table, a polishing head and a suspension pad, where the surface of the wafer moves across the pad, under pressure, in the presence of slurry abrasive. The liquid suspension provides the abrasive particles and the right chemistry for the CMP performing
Sign-in/Register to view highlights & summary Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
